Title :
Silicon wafer-area network: intelligent communications fabric for parallel computing
Author :
Petrova, I.V. ; Uppuluri, M.T. ; Tewksbury, S.K. ; Hornak, Lawrence A.
Author_Institution :
Dept. of Electr. & Comput. Eng., West Virginia Univ., Morgantown, WV, USA
Abstract :
The SWAN (silicon wafer-area network) project described explores the application of the high speed and high density of interconnections in WSI and MCM technologies to new communications schemes for general purpose, parallel arrays of computing nodes. The SWAN architecture seeks to provide on-demand, point-to-point communications through dynamically allocated routes for fine-grained communications
Keywords :
VLSI; multichip modules; multiprocessor interconnection networks; parallel architectures; MCM technologies; SWAN architecture; WSI; dynamically allocated routes; fine-grained communications; interconnections; parallel arrays; point-to-point communications; silicon wafer-area network; Computer architecture; Computer networks; Concurrent computing; Fabrics; Intelligent networks; Microelectronics; Parallel processing; Routing; Silicon; Switches;
Conference_Titel :
Wafer Scale Integration, 1994. Proceedings., Sixth Annual IEEE International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-1850-1
DOI :
10.1109/ICWSI.1994.291237
