• DocumentCode
    1858044
  • Title

    Test and reconfiguration experiments for a defect-tolerant large area monolithic multiprocessor system

  • Author

    Otterstedt, J. ; Iden, H.-J. ; Kuboschek, M.

  • Author_Institution
    Lab. fur Informationstechnologie, Hannover Univ., Germany
  • fYear
    1994
  • fDate
    19-21 Jan 1994
  • Firstpage
    315
  • Lastpage
    323
  • Abstract
    The results of test and self-configuration of an experimental large area chip are described. The chip features all the logic required for the global test and configuration of a coarse-grained MIMD multiprocessor system. These structures are implemented on the 16 cm2 Large Area Integrated Circuit 1 (LAIC 1). This chip utilizes different redundancy and reconfiguration concepts: 1) A defect-tolerant configuration network provides the connections of the modules. 2) System access is provided by a multiple-defect tolerant unidirectional scan path. 3) A repair of the primary I/O-buses is performed by programming laser fuses and anti-fuses. 4) The use of TMR for system clock and dual-rail signals for control lines enables an initial access to the system without laser repair. The results presented in this paper show, that all the proposed redundancy and reconfiguration concepts together provide a suitable scheme for the test and configuration of a large area chip containing coarse-grained modules with high module connectivity. These schemes have been proven to work even under adverse conditions such as large defects and high defect densities
  • Keywords
    VLSI; circuit reliability; computer testing; fault tolerant computing; integrated circuit testing; microprocessor chips; multiprocessing systems; redundancy; MIMD multiprocessor system; WSI; coarse-grained modules; defect-tolerant configuration network; global test; high module connectivity; large area chip; laser antifuses; laser fuses; monolithic multiprocessor system; reconfiguration; redundancy; unidirectional scan path; Automatic testing; Circuit testing; Clocks; Fuses; Logic testing; Multiprocessing systems; Optical control; Reconfigurable logic; Redundancy; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wafer Scale Integration, 1994. Proceedings., Sixth Annual IEEE International Conference on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-1850-1
  • Type

    conf

  • DOI
    10.1109/ICWSI.1994.291242
  • Filename
    291242