Title :
Design of a large area magnetic field sensor array
Author :
Audet, Yves ; Chapman, Glenn H.
Author_Institution :
Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
Abstract :
The circuit design of a Large Area Magnetic Field Sensor Array (LAMFSA) using CMOS 3 μm process is described. This prototype is developed mainly for application in magnetic field mapping and tactile array sensors. In order to enable the production of such a device, redundancy schemes are implemented and a laser interconnection post fabrication technique is used. The basic sensing cell consists of a double drain/double source MOS magnetic field sensor (MAGFET). The design architecture is strongly influenced by the sensor function and the defect avoidance criteria. Aided by SPICE, test and reconfiguration issues involved in the post fabrication processing are described
Keywords :
CMOS integrated circuits; electric sensing devices; integrated circuit testing; magnetic field measurement; redundancy; 3 micron; CMOS process; MAGFET; MOS magnetic field sensor; SPICE; defect avoidance criteria; double drain/double source MOS device; large area magnetic field sensor array; laser interconnection post fabrication technique; magnetic field mapping; reconfiguration; redundancy schemes; tactile array sensors; test; CMOS process; Circuit synthesis; Integrated circuit interconnections; Magnetic sensors; Optical device fabrication; Production; Prototypes; Sensor arrays; Sensor phenomena and characterization; Tactile sensors;
Conference_Titel :
Wafer Scale Integration, 1994. Proceedings., Sixth Annual IEEE International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-1850-1
DOI :
10.1109/ICWSI.1994.291245
