Title :
Recent advances in interconnect technology for slim-base biomedical probe arrays
Author :
Aarts, A.A.A. ; Neves, H.P. ; Puers, R. ; Van Hoof, C.
Author_Institution :
IMEC, Leuven, Belgium
Abstract :
An interconnect technology for out-of-plane biomedical probe arrays has been demonstrated. The shafts of the probe array are assembled perpendicular to a common base or platform. During assembly of the probes a mechanical and electrical connection has been made. In order to assess the integrity of the assembly, a pulling test has been done. Recently the interconnect density has been improved to a pitch of 35 mum to realize the interconnects for active probe arrays.
Keywords :
bioMEMS; integrated circuit interconnections; microassembling; microfabrication; probes; SLIM-base biomedical probe arrays; active probe arrays; electrical connection; interconnect density; interconnect technology; mechanical connection; out-of-plane biomedical probe arrays; Assembly; Biomedical measurements; Blades; Contacts; Gold; Probes; Rough surfaces; Surface cracks; Surface roughness; System testing; Out-of-plane probe array; interconnect;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
DOI :
10.1109/SENSOR.2009.5285678
