Title :
High performance low temperature activated devices and optimization guidelines for 3D VLSI integration of FD, TriGate, FinFET on insulator
Author :
Pasini, L. ; Batude, P. ; Casse, M. ; Mathieu, B. ; Sklenard, B. ; Luce, F. Piegas ; Reboh, S. ; Bernier, N. ; Tabone, C. ; Rozeau, O. ; Martini, S. ; Fenouillet-Beranger, C. ; Brunet, L. ; Audoit, G. ; Lafond, D. ; Aussenac, F. ; Allain, F. ; Romano, G.
Abstract :
3D VLSI integration is a promising alternative path towards CMOS scalability. It requires Low Temperature (LT) processing (≤600°C) for top FET fabrication. In this work, record performance is demonstrated for LT TriGate and FDSOI devices using Solid Phase Epitaxy (SPE). Optimization guidelines for further performance improvement are given for FD, TriGate and FinFET on insulator with the constraint of 14nm node channel strain preservation. This work concludes that extension first process scheme (implantation before the raised source and drain epitaxy) is required for FDSOI and TriGate architectures.
Keywords :
CMOS integrated circuits; MOSFET; circuit optimisation; epitaxial growth; integrated circuit design; three-dimensional integrated circuits; 3D VLSI integration; CMOS scalability; FDSOI devices; FinFET-on-insulator; high performance activated device; low temperature activated device; low temperature processing; optimization guidelines; solid phase epitaxy; trigate field effect transistor; Epitaxial growth; FinFETs; Implants; Junctions; Performance evaluation; Strain; Very large scale integration;
