DocumentCode :
185819
Title :
Low-power ovenization of fused silica resonators for temperature-stable oscillators
Author :
Zhengzheng Wu ; Peczalski, A. ; Rais-Zadeh, Mina
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Univ. of Michigan, Ann Arbor, MI, USA
fYear :
2014
fDate :
19-22 May 2014
Firstpage :
1
Lastpage :
5
Abstract :
In this paper, we report on temperature-stable operation of silica MEMS oscillators on an ovenized fused silica platform. Temperature servo-control circuits are implemented using an on-chip RTD-based temperature sensor and a resistive heater. A wide-range linear analog controller has been implemented to reduce the effective TCF of the fused silica resonator by an order of magnitude. Digital calibration method is used to mitigate offset errors caused by non-ideal temperature sensing. By effectively removing the offset errors, the frequency drift of an oscillator using a silica micromechanical resonator is reduced to less than 11 ppm over 105 °C of external temperature change. The power consumption to ovenize the entire platform consisting of four resonators is lower than 15.8 mW.
Keywords :
calibration; low-power electronics; micromechanical resonators; oscillators; power consumption; servomechanisms; silicon compounds; temperature control; temperature sensors; thermal stability; SiO2; TCF; digital calibration method; frequency drift; fused silica resonators; low-power ovenization; nonideal temperature sensing; offset errors; on-chip RTD-based temperature sensor; ovenized fused silica platform; power consumption; resistive heater; resistive temperature detector; silica MEMS oscillators; silica micromechanical resonator; temperature 105 degC; temperature coefficient of frequency; temperature servo-control circuits; temperature-stable operation; temperature-stable oscillators; wide-range linear analog controller; Heating; Micromechanical devices; Oscillators; Silicon compounds; Temperature measurement; Temperature sensors; MEMS; micromechanical; oscillator; ovenized MEMS; resonator; temperature compensation; thermal isolation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Frequency Control Symposium (FCS), 2014 IEEE International
Conference_Location :
Taipei
Type :
conf
DOI :
10.1109/FCS.2014.6859876
Filename :
6859876
Link To Document :
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