DocumentCode
185819
Title
Low-power ovenization of fused silica resonators for temperature-stable oscillators
Author
Zhengzheng Wu ; Peczalski, A. ; Rais-Zadeh, Mina
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Univ. of Michigan, Ann Arbor, MI, USA
fYear
2014
fDate
19-22 May 2014
Firstpage
1
Lastpage
5
Abstract
In this paper, we report on temperature-stable operation of silica MEMS oscillators on an ovenized fused silica platform. Temperature servo-control circuits are implemented using an on-chip RTD-based temperature sensor and a resistive heater. A wide-range linear analog controller has been implemented to reduce the effective TCF of the fused silica resonator by an order of magnitude. Digital calibration method is used to mitigate offset errors caused by non-ideal temperature sensing. By effectively removing the offset errors, the frequency drift of an oscillator using a silica micromechanical resonator is reduced to less than 11 ppm over 105 °C of external temperature change. The power consumption to ovenize the entire platform consisting of four resonators is lower than 15.8 mW.
Keywords
calibration; low-power electronics; micromechanical resonators; oscillators; power consumption; servomechanisms; silicon compounds; temperature control; temperature sensors; thermal stability; SiO2; TCF; digital calibration method; frequency drift; fused silica resonators; low-power ovenization; nonideal temperature sensing; offset errors; on-chip RTD-based temperature sensor; ovenized fused silica platform; power consumption; resistive heater; resistive temperature detector; silica MEMS oscillators; silica micromechanical resonator; temperature 105 degC; temperature coefficient of frequency; temperature servo-control circuits; temperature-stable operation; temperature-stable oscillators; wide-range linear analog controller; Heating; Micromechanical devices; Oscillators; Silicon compounds; Temperature measurement; Temperature sensors; MEMS; micromechanical; oscillator; ovenized MEMS; resonator; temperature compensation; thermal isolation;
fLanguage
English
Publisher
ieee
Conference_Titel
Frequency Control Symposium (FCS), 2014 IEEE International
Conference_Location
Taipei
Type
conf
DOI
10.1109/FCS.2014.6859876
Filename
6859876
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