Title :
The influence of packaging technologies on the performance of inertial MEMS sensors
Author :
Mehner, J. ; Kolchuzhin, V. ; Schmadlak, I. ; Hauck, T. ; Li, G. ; Lin, D. ; Miller, T.F.
Author_Institution :
Chemnitz Univ. of Technol., Chemnitz, Germany
Abstract :
The paper is focused on the influence of packaging technologies on the performance of inertial MEMS sensors. System simulations of MEMS are vital to evaluate and optimize the interplay of transducer cells with the sensor electronics. Special emphasis must be put on packaging aspects in order to assess the impact of environmental and operating conditions on functional parameters as capacitance offset or loss of sensitivity affected by thermal-mechanical stress or structural deformation. This article presents modern reduced order modeling technologies which extract fast and accurate behavioral models from a series of finite element runs which can directly be used in Matlab/Simulink or Verilog-A for system design.
Keywords :
electronics packaging; finite element analysis; hardware description languages; microsensors; reduced order systems; Matlab; Simulink; Verilog-A; behavioral model; environmental impact; finite element model; inertial MEMS sensor; packaging technology; reduced order modeling; structural deformation; system simulation; thermal-mechanical stress; Capacitance; Electronic packaging thermal management; Electronics packaging; Finite element methods; Mathematical model; Micromechanical devices; Paper technology; Sensor systems; Thermal stresses; Transducers; Reduced order modeling; inertial sensors; modal superposition method; packaging interactions;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
DOI :
10.1109/SENSOR.2009.5285685
