• DocumentCode
    1858458
  • Title

    Harvest model of an integrated hierarchical-bus architecture

  • Author

    Kermouche, R. ; Savaria, Y. ; Audet, D.

  • Author_Institution
    Dept. of Electr. Eng., Ecole Polytech. de Montreal, Que., Canada
  • fYear
    1994
  • fDate
    19-21 Jan 1994
  • Firstpage
    69
  • Lastpage
    78
  • Abstract
    This paper presents a new approach to model the yield of a fault-tolerant hierarchical-bus structure, based on the expected value of the number of functional processors. With this method, easily computable mathematical expressions were obtained. Also, a defect tolerant communication network structure is proposed and analyzed in terms of additional hardware cost versus spares allocation. Assuming the network was successfully repaired, global reconfiguration of defective processing modules is then supported. Otherwise some graceful degradation would result. The results obtained, in terms of optimal distribution of spares in the communication network, show that complete duplication is not cost effective. However, redundancy can be added to the uppermost levels of the hierarchical tree in a very effective manner. Two harvest formulas were obtained; the first is an easily computed lower bound, and the second is exact according to the assumed defect density
  • Keywords
    VLSI; fault tolerant computing; microprocessor chips; parallel architectures; WSI; assumed defect density; defect tolerant communication network structure; expected value; fault-tolerant hierarchical-bus structure; functional processors; global reconfiguration; harvest formulas; hierarchical tree; integrated hierarchical-bus architecture; parallel architectures; spares allocation; yield; Circuit faults; Communication networks; Computer architecture; Cost function; Degradation; Fault tolerance; Hardware; Integrated circuit interconnections; Redundancy; Ultra large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wafer Scale Integration, 1994. Proceedings., Sixth Annual IEEE International Conference on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-1850-1
  • Type

    conf

  • DOI
    10.1109/ICWSI.1994.291262
  • Filename
    291262