Title :
Novel 3D force sensor using ultra-thin silicon strain gauge bonded on metal membrane
Author :
Kim, Y.D. ; Kim, Y.D. ; Lee, C.S. ; Kwon, S.J.
Author_Institution :
KAIST, Daejeon, South Korea
Abstract :
In the present paper, we propose a novel 3D force sensor design using a silicon strain gauge bonded on a metal diaphragm. The fabrication process and glass frit bonding process of the ultra-thin silicon strain gauges having a thickness of 50 mum were established; afterward, performance of the silicon strain gauge bonded on the stainless steel cantilever beam was evaluated at the various conditions. In results, resistance linearly increased with deformation by tensile stress, and gauge factor representing the sensitivity of the strain gauge was 33.77. Nonlinearity and hysteresis were respectively 0.21%FS and 0.17%FS.
Keywords :
bonding processes; cantilevers; deformation; diaphragms; elemental semiconductors; force sensors; hysteresis; membranes; semiconductor devices; silicon; strain gauges; 3D force sensor; Si; cantilever beam; deformation; fabrication process; gauge factor; glass frit bonding process; hysteresis; metal diaphragm; metal membrane; size 50 mum; strain gauge sensitivity; tensile stress; ultrathin silicon strain gauge; Biomembranes; Bonding forces; Bonding processes; Capacitive sensors; Fabrication; Force sensors; Glass; Silicon; Steel; Structural beams; 3D force sensor; MEMS strain gauge; Poly-Si strain gauge; glass frit bonding; ultra-thin strain gauge;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
DOI :
10.1109/SENSOR.2009.5285694