• DocumentCode
    1858537
  • Title

    Tiny (0.72 mm2) pressure sensor integrating MEMS and CMOS LSI with back-end-of-line MEMS platform

  • Author

    Fujimori, T. ; Takano, H. ; Machida, S. ; Goto, Y.

  • Author_Institution
    Central Res. Lab., Hitachi Ltd., Kokubunji, Japan
  • fYear
    2009
  • fDate
    21-25 June 2009
  • Firstpage
    1924
  • Lastpage
    1927
  • Abstract
    A back-end-of-line (BEOL) MEMS platform for a compact, high-precision pressure sensor was developed. A CMOS-LSI-integrated MEMS pressure-sensor chip (with a size of 0.72 mm2) was fabricated on the platform. The sensor provides both high accuracy and accommodates miniaturization. Its sensitivity offers design flexibility simply by changing the size of its MEMS capacitors. The pressure sensor is thus suitable for various pressure-range applications.
  • Keywords
    CMOS integrated circuits; capacitive sensors; large scale integration; microfabrication; microsensors; pressure sensors; CMOS-LSI-integrated MEMS; MEMS capacitors; back-end-of-line MEMS platform; high-precision pressure sensor design; tiny pressure sensor fabrication; CMOS process; Capacitive sensors; Capacitors; Digital circuits; Electrodes; Fabrication; Large scale integration; Micromechanical devices; Silicon; Tin; CMOS; Monolithic integration; Pressure sensor; Tungsten-silicide; WSi;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
  • Conference_Location
    Denver, CO
  • Print_ISBN
    978-1-4244-4190-7
  • Electronic_ISBN
    978-1-4244-4193-8
  • Type

    conf

  • DOI
    10.1109/SENSOR.2009.5285695
  • Filename
    5285695
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1858537