Title :
Tiny (0.72 mm2) pressure sensor integrating MEMS and CMOS LSI with back-end-of-line MEMS platform
Author :
Fujimori, T. ; Takano, H. ; Machida, S. ; Goto, Y.
Author_Institution :
Central Res. Lab., Hitachi Ltd., Kokubunji, Japan
Abstract :
A back-end-of-line (BEOL) MEMS platform for a compact, high-precision pressure sensor was developed. A CMOS-LSI-integrated MEMS pressure-sensor chip (with a size of 0.72 mm2) was fabricated on the platform. The sensor provides both high accuracy and accommodates miniaturization. Its sensitivity offers design flexibility simply by changing the size of its MEMS capacitors. The pressure sensor is thus suitable for various pressure-range applications.
Keywords :
CMOS integrated circuits; capacitive sensors; large scale integration; microfabrication; microsensors; pressure sensors; CMOS-LSI-integrated MEMS; MEMS capacitors; back-end-of-line MEMS platform; high-precision pressure sensor design; tiny pressure sensor fabrication; CMOS process; Capacitive sensors; Capacitors; Digital circuits; Electrodes; Fabrication; Large scale integration; Micromechanical devices; Silicon; Tin; CMOS; Monolithic integration; Pressure sensor; Tungsten-silicide; WSi;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
DOI :
10.1109/SENSOR.2009.5285695
