DocumentCode
1858567
Title
Proceedings of 1994 International Conference on Wafer Scale Integration (ICWSI)
fYear
1994
fDate
19-21 Jan. 1994
Abstract
The following topics were dealt with: applications; yield assessment; reconfiguration; WSI evolution; testability; physical issues
Keywords
VLSI; circuit CAD; circuit layout CAD; integrated circuit technology; integrated circuit testing; WSI evolution; physical issues; reconfiguration; testability; wafer scale integration; yield assessment;
fLanguage
English
Publisher
ieee
Conference_Titel
Wafer Scale Integration, 1994. Proceedings., Sixth Annual IEEE International Conference on
Conference_Location
San Francisco, CA, USA
Print_ISBN
0-7803-1850-1
Type
conf
DOI
10.1109/ICWSI.1994.291267
Filename
291267
Link To Document