Flexible 3D channels and cavities formation by nanoimprinting

Author

Pang, S.W.

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA

fYear

2005

fDate

11-15 July 2005

Firstpage

450

Abstract

Nanoimprinting technique called reversal imprinting is developed to produce flexible 3-dimensional 3D nanostructures. A sealed 3D nanochannel networks is developed using sequentially stacked thermal nanoimprint lithography on planarized self-supporting dielectric sealing material over polymer sacrificial layers. Moreover, a 3D polymeric micro and nanostructures are generated using a duo-mold imprinting process. The unique patterning capabilities of this patterning technique are difficult to accomplish using conventional patterning techniques.

Keywords

dielectric materials; flexible structures; nanolithography; nanostructured materials; polymers; soft lithography; 3D nanochannel networks; 3D polymeric micro; cavities formation; dielectric sealing material; duo-mold imprinting process; flexible 3D channels; flexible 3D nanostructures; nanoimprinting; planarized sealing material; polymer sacrificial layers; reversal imprinting; self-supporting sealing material; sequentially stacked nanoimprint lithography; thermal nanoimprint lithography; Application software; Coatings; Dielectric substrates; Gratings; Nanolithography; Nanostructures; Plasma temperature; Polymer films; Surface treatment; USA Councils;

fLanguage

English

Publisher

ieee

Conference_Titel

Nanotechnology, 2005. 5th IEEE Conference on

Print_ISBN

0-7803-9199-3

Type

conf

DOI

10.1109/NANO.2005.1500796

Filename

1500796