• DocumentCode
    1858997
  • Title

    Laboratory study of potential induced degradation of silicon photovoltaic modules

  • Author

    Schütze, M. ; Junghänel, M. ; Koentopp, M.B. ; Cwikla, S. ; Friedrich, S. ; Müller, J.W. ; Wawer, P.

  • Author_Institution
    Q-Cells SE, Bitterfeld-Wolfen, Germany
  • fYear
    2011
  • fDate
    19-24 June 2011
  • Abstract
    The standard system architecture of PV installations exposes solar modules to bias voltages of several hundred volts. Recently it became apparent that high bias voltages can have negative effects on the long-term performance of standard screen-printed crystalline silicon solar cells. This paper focuses on the study of this potential induced degradation effect (PID) under laboratory conditions. A corona-discharge assembly was used to polarize mini modules as well as a setup to expose 60-cell modules to high bias under wet conditions. Different encapsulation setups and cell process variations are studied to identify the necessary components leading to PID. I-V measurements, electroluminescence imaging and dark lock-in thermography are employed to obtain detailed characteristics of PID. A correlation between local current loss and shunt conductivity was found. Options to prevent PID on module and cell levels were found and verified experimentally.
  • Keywords
    corona; elemental semiconductors; leakage currents; silicon; solar cells; I-V measurement; PV installations; Si; cell process variations; corona discharge; dark lock-in thermography; electroluminescence imaging; encapsulation setups; potential induced degradation; screen printed crystalline silicon solar cell; shunt conductivity; silicon photovoltaic modules; wet condition; Assembly; Conductivity; Degradation; Electric potential; Glass; Photovoltaic cells; Resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
  • Conference_Location
    Seattle, WA
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-9966-3
  • Type

    conf

  • DOI
    10.1109/PVSC.2011.6186080
  • Filename
    6186080