Title :
Observations on cutting edge radius effects in cryogenic machining of porous tungsten
Author :
Busbaher, Daniel ; Schoop, Julius ; Jawahir, I.S. ; Balk, T. John
Author_Institution :
Ceradyne Inc., Lexington, KY, USA
Abstract :
Porous tungsten is a refractory metal commonly used to manufacture dispenser cathode pellets. To produce the required geometric shape of a cathode, precision machining of the emitting surface is necessary. Because dry machining leads to excessive tool wear and smearing of surface pores, a plastic infiltrant is used to both prevent smearing and lubricate the cut. In order to develop a sustainable alternative to this plastic infiltration process, infiltrant-free cryogenic machining of porous tungsten has been identified by previous studies to be capable of producing excellent levels of surface porosity [1-3]. Cryogenic cooling during machining of porous tungsten allows for controlled brittle fracture machining, leading to relatively poor surface roughness [3]. Consequently, improving the surface quality of cryogenically machined porous tungsten surfaces is a necessary condition for the successful implementation of this technology.
Keywords :
brittle fracture; cathodes; cooling; cryogenics; cutting; lubrication; machining; palletising; porosity; porous materials; refractories; surface roughness; sustainable development; tungsten; wear; cathode geometric shape; controlled brittle fracture machining; cryogenic cooling; cryogenically machined porous tungsten surface quality improvement; cut lubrication prevention; cut smearing prevention; cutting edge radius effects; dispenser cathode pellet manufacturing; dry machining; emitting surface precision machining; plastic infiltrant; plastic infiltration process; poor surface roughness; porous tungsten infiltrant-free cryogenic machining; refractory metal; surface pore smearing; surface porosity; tool wear; Cryogenics; Diamonds; Machining; Rough surfaces; Surface roughness; Surface treatment; Tungsten; cryogenic machining; cutting edge radius; dispenser cathode; porous tungsten; surface integrity;
Conference_Titel :
Vacuum Electronics Conference (IVEC), 2015 IEEE International
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-7109-1
DOI :
10.1109/IVEC.2015.7223754