Title :
Implementation of a novel zero-insertion-force (ZIF) mems-connector
Author :
Jang, Ben-Hwa ; Huang, Hsin-Yu ; Fang, Weileun
Abstract :
This paper demonstrated on the design, fabrication, and testing of a novel zero-insertion-force (ZIF) MEMS-connector. The three-mask and silicon-on-insulator (SOI) wafer were designed for the easy fabrication of the terminals and latches simultaneously. The terminal was a multi-morph cantilever to form a hook-like shape providing the reliable contact at the contact interface. The terminals and the latches were actuated by electrostatic force to avoid wearing and kinking during the mating process. The implementation details were provided and the property measurement results were conducted to confirm the feasibility and superiority of the proposed ZIF MEMS-connector.
Keywords :
electric connectors; flip-flops; microfabrication; micromechanical devices; silicon-on-insulator; wafer level packaging; ZIF MEMS-connector; contact interface; electrostatic force; hook-like shape; latches; mating process; multi-morph cantilever; silicon-on-insulator wafer; three-mask wafer; zero-insertion-force MEMS-connector; Chemical industry; Connectors; Contacts; Fabrication; Micromechanical devices; Plugs; Residual stresses; Shape control; Testing; Transistors; Microelectromechanical systems (MEMS) connectors; Zero insertion force; out-of-plane shape control;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
DOI :
10.1109/SENSOR.2009.5285731