Title :
Surface mount package for high frequency band
Author :
Morioka, Shigeki ; Sawa, Yoshinobu
Author_Institution :
Design Center, Kyocera Corp., Shiga, Japan
Abstract :
The ultimate goal for cost effective millimeterwave MMIC packages is to provide miniature, lightweight surface mountable solutions. This paper describes the design technologies of a novel approach, where the via holes were optimized through the multilayer ceramic structure. The results of this research, produced a package, RF-VIA Package, with an insertion loss of about 1 dB at 32 GHz (the measurement includes transitions through two substrates, one feedthrough and through one gold ribbon bond) has been accomplished
Keywords :
MIMIC; integrated circuit packaging; surface mount technology; 1 dB; 32 GHz; RF-VIA Package; high frequency band; insertion loss; millimeter-wave MMIC package; multilayer ceramic structure; surface mount package; via hole; Ceramics; Costs; Design optimization; Frequency; Insertion loss; Loss measurement; MMICs; Millimeter wave technology; Nonhomogeneous media; Packaging;
Conference_Titel :
Microwave Conference, 1999 Asia Pacific
Print_ISBN :
0-7803-5761-2
DOI :
10.1109/APMC.1999.833755
