Title :
High frequency characterization of a chip scale BGA package
Author :
Yeo, Yong Kee ; Iyer, Mahadevan K. ; Youlin Qiu ; Leong, Mook Seng ; Ooi, Ban Leong
Author_Institution :
Adv. Packaging Dev. Support Dept, Inst. of Microelectron., Singapore
Abstract :
The electrical characteristics and high frequency behavior of a chip scale package have been studied using a commercial full wave EM solver. The resulting simulation models are verified by frequency domain measurements
Keywords :
ball grid arrays; chip scale packaging; chip scale BGA package; frequency domain measurement; full-wave EM simulation model; high frequency electrical characteristics; Bonding; Capacitance; Chip scale packaging; Computational modeling; Conductors; Copper; Frequency measurement; Personal digital assistants; Testing; Wire;
Conference_Titel :
Microwave Conference, 1999 Asia Pacific
Print_ISBN :
0-7803-5761-2
DOI :
10.1109/APMC.1999.833757
