• DocumentCode
    1860624
  • Title

    High aspect ratio microelectromechanical systems: A versatile approach using carbon nanotubes as a framework

  • Author

    Hutchison, D.N. ; Aten, Q. ; Turner, B. ; Morrill, N. ; Howell, L.L. ; Jensen, B.D. ; Davis, R.C. ; Vanfleet, R.R.

  • Author_Institution
    Brigham Young Univ., Provo, UT, USA
  • fYear
    2009
  • fDate
    21-25 June 2009
  • Firstpage
    1604
  • Lastpage
    1607
  • Abstract
    We recently developed a fabrication process for carbon nanotube templated MEMS. The fabrication process involves growing a three dimensional pattern from carbon nanotube forests and filling that forest by chemical vapor infiltration to make a solid structure. This templating process allows us to fabricate extremely high aspect ratio microscale structures from a wide variety of materials. The nanotube structures can be hundreds of microns tall with lateral pattern dimensions down to a few microns. The chemical vapor infiltration has been shown with silicon and silicon nitride but could be extended to many other materials. In this paper, we investigate the microstructure of the filling material and extend the process to the fabrication of comb actuators.
  • Keywords
    carbon nanotubes; chemical vapour infiltration; micromechanical devices; carbon nanotube forest; carbon nanotube templated MEMS; chemical vapor infiltration; comb actuator; fabrication process; filling material; high aspect ratio microelectromechanical system; microscale structure; solid structure; templating process; Carbon nanotubes; Chemical processes; Fabrication; Filling; Microelectromechanical systems; Micromechanical devices; Microstructure; Nanostructured materials; Nanostructures; Silicon; Vertically aligned carbon nanotubes; chemical vapor infiltration; comb actuators; high aspect ratio;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
  • Conference_Location
    Denver, CO
  • Print_ISBN
    978-1-4244-4190-7
  • Electronic_ISBN
    978-1-4244-4193-8
  • Type

    conf

  • DOI
    10.1109/SENSOR.2009.5285766
  • Filename
    5285766