DocumentCode :
1860676
Title :
Minimized blurring in stencil lithography using a compliant membrane
Author :
Sidler, K. ; Villanueva, G. ; Vazquez-Mena, O. ; Brugger, J.
Author_Institution :
Microsyst. Lab., Ecole Polytech. Fed. de Lausanne (EPFL), Lausanne, Switzerland
fYear :
2009
fDate :
21-25 June 2009
Firstpage :
1612
Lastpage :
1615
Abstract :
This work reports on advanced stencil lithography using compliant membranes. Compliant membranes are mechanically decoupled from a rigid silicon frame by means of four non planar cantilevers. Compliant membranes are protruding parts which adapt to the surface independently in order to reduce the gap between a membrane and its substrate. FEM simulations show that compliant membranes can vertically deflect 40 mum which is a typical maximal gap. Microapertures were defined using UV lithography and nanoapertures, down to 200 nm in diameter, using FIB. A 100 nm thick aluminum layer was evaporated through compliant and non compliant membranes on a silicon wafer. Subsequent SEM characterizations have shown a smaller halo diameter around the structures patterned by compliant membranes.
Keywords :
aluminium; cantilevers; finite element analysis; focused ion beam technology; scanning electron microscopy; silicon; ultraviolet lithography; Al; FEM simulations; FIB; SEM; Si; UV lithography; aluminum layer; compliant membrane; microapertures; minimized blurring; nanoapertures; nonplanar cantilevers; rigid silicon frame; silicon wafer; stencil lithography; Apertures; Biomembranes; Dry etching; Fabrication; Geometry; Lithography; Resists; Silicon compounds; Solid modeling; Substrates; Stencil lithography; blurring; compliant membrane; nano-apertures; shadow mask;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
Type :
conf
DOI :
10.1109/SENSOR.2009.5285768
Filename :
5285768
Link To Document :
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