Title :
Glass-fritless Cu alloy pastes for silicon solar cells recquiring low temperature sintering
Author :
Tokuhisa, Hideo ; Yoshida, Manabu ; Itoh, Uichi ; Sumita, Isao ; Sekine, Shigenobu ; Kamata, Toshihide
Author_Institution :
Nat. Inst. of Adv. Ind. & Sci. Technol. (AIST), Tsukuba, Japan
Abstract :
This paper describes a novel Cu paste for low temperature sintering, which is necessary to fabricate electrodes on transparent conductive films in hetero-junction solar cell. To this end, glass fritless Cu alloy pastes containing a low melting point alloy were prepared. The pastes were evaluated in terms of printability, contact resistance, line resistance, adhesive property, and oxidation resistance. As a result, it can be concluded that the pastes would be applicable for silicon solar cells requiring low temperature process.
Keywords :
adhesives; copper alloys; glass; melting point; oxidation; silicon; sintering; solar cells; Si; adhesive property; contact resistance; electrodes; glass-fritless copper alloy pastes; hetero-junction solar cell; line resistance; low melting point alloy; low temperature process; low temperature sintering; oxidation resistance; printability; silicon solar cells; transparent conductive films; Conductivity; Contacts; Copper; Photovoltaic cells; Resistance; Silicon;
Conference_Titel :
Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
978-1-4244-9966-3
DOI :
10.1109/PVSC.2011.6186154