Title :
Real-time temperature monitoring in pharmaceutical freeze-drying
Author :
Grassini, Sabrina ; Fulginiti, Daniele ; Pisano, Roberto ; Oddone, Irene ; Parvis, Marco
Author_Institution :
Dipt. di Scienza Appl. e Tecnol., Politec. di Torino, Turin, Italy
Abstract :
In this study, a thermocouple array realized by using thin film strips is employed for real-time temperature measurements during pharmaceutical freeze-drying. The thin film thermocouple array is directly deposited on the vial walls and can be employed to monitor the temperature evolution during the freezing stage. Freezing is a critical stage of the entire cycle, since the nucleation temperature influences the morphology of the dried material and, consequently, the subsequent drying phase. Since conventional thermocouples are too invasive, due to the high thermal conductivity of the metallic wires, which alter the product nucleation, innovative measuring approaches have to be developed and validated to optimize the drying cycles. Moreover, conventional thermocouples allow only one-point measurement to be obtained, while the possibility of realizing thermocouple arrays offered by the thin film technology, can give more reliable results.
Keywords :
biomedical measurement; drying; freezing; nucleation; pharmaceutical technology; pharmaceuticals; temperature measurement; thermal conductivity; thermocouples; thin film sensors; conventional thermocouples; dried material morphology; drying cycles; freezing stage; metallic wires; nucleation temperature; one-point measurement; pharmaceutical freeze-drying; product nucleation; real-time temperature measurement; real-time temperature monitoring; subsequent drying phase; temperature evolution; thermal conductivity; thin film strips; thin film technology; thin film thermocouple array; vial walls; Arrays; Ice; Monitoring; Pharmaceuticals; Temperature measurement; Temperature sensors; Wires; Sputtered TC; TC array; freeze-drying; temperature measurements; thin films;
Conference_Titel :
Medical Measurements and Applications (MeMeA), 2014 IEEE International Symposium on
Conference_Location :
Lisboa
Print_ISBN :
978-1-4799-2920-7
DOI :
10.1109/MeMeA.2014.6860051