Fabrication of Einzel lens array with one-mask RIE process for electron micro-optics

This paper reports the fabrication technique of electron micro-optics using silicon deep reactive ion etching. Stacked 120-mum-thick three silicon wafers stacked with cavities using patterned glass substrates are etched by ldquoa direct cavity through etching techniquerdquo. An array of the electron micro-optics consisted of three electrodes can be fabricated by one-mask process without alignment. The etched profiles of this cavity through etching are also investigated. This fabrication technology of electron lens is useful for making future multi-electron beam devices with electron optics.