• DocumentCode
    1862049
  • Title

    Interaction of redistribution traces with on-wafer interconnects in memory chip packaging

  • Author

    Gospodinova, M. ; Ktata, M.F. ; Koellermeyer, J. ; Nan, G. ; Vogl, M. ; Thomas, J.

  • Author_Institution
    Memory Products Div., Infineon Technol., Munich, Germany
  • fYear
    2005
  • fDate
    10-13 May 2005
  • Firstpage
    171
  • Lastpage
    174
  • Abstract
    In this paper, we investigate the interaction between redistribution traces and on-chip interconnects in memory chip packages. The electromagnetic interaction is shown both in the frequency and in the time domain. In addition the impact of this interaction on the performance of memory component(s) is explored.
  • Keywords
    frequency-domain analysis; integrated circuit interconnections; integrated circuit packaging; integrated memory circuits; time-domain analysis; electromagnetic interaction; frequency domain; memory chip packaging; on-wafer interconnects; redistribution traces; time domain; Bonding; Data mining; Electromagnetic fields; Frequency; Magnetic properties; Manufacturing; Packaging; Product design; Semiconductor device modeling; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects, 2005. Proceedings. 9th IEEE Workshop on
  • Print_ISBN
    0-7803-9054-7
  • Type

    conf

  • DOI
    10.1109/SPI.2005.1500936
  • Filename
    1500936
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1862049