Title :
1-Tbyte/s 1-Gbit DRAM architecture with micro-pipelined 16-DRAM cores, 8-ns cycle array and 16-Gbit/s 3D interconnect for high throughput computing
Author :
Ono, K. ; Kotabe, A. ; Yanagawa, Y. ; Sekiguchi, T.
Author_Institution :
Central Res. Lab., Hitachi, Ltd., Tokyo, Japan
Abstract :
A novel DRAM architecture with an ultra-high bandwidth is proposed for high throughput computing. The proposed architecture employs three techniques: 1) five-stage pipelined 16-DRAM cores, 2) an early bar write scheme for an 8-ns cycle array operation, and 3) a 16-Gbit/s I/O circuit on each of 32 through-silicon-via pairs/DRAM core. We conducted a circuit simulation assuming a 45-nm 1-Gbit chip and confirmed that the proposed architecture achieved a 1-Tbyte/s bandwidth with 19.5-W power consumption.
Keywords :
DRAM chips; circuit simulation; cores; integrated circuit interconnections; microprocessor chips; three-dimensional integrated circuits; 3D interconnect; DRAM architecture; I/O circuit; bar write scheme; bit rate 16 Gbit/s; byte rate 1 TByte/s; circuit simulation; high throughput computing; micropipelined 16-DRAM cores; microprocessor chip; power 19.5 W; size 45 nm; storage capacity 1 Gbit; through-silicon-via pairs; time 8 ns; ultra-high bandwidth; Arrays; Bandwidth; Central Processing Unit; Power demand; Random access memory; Through-silicon vias;
Conference_Titel :
VLSI Circuits (VLSIC), 2010 IEEE Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4244-5454-9
DOI :
10.1109/VLSIC.2010.5560305