• DocumentCode
    1862260
  • Title

    Substrate loss of on-chip transmission-lines with power/ground wires in lower layer

  • Author

    Tsuchiya, Akira ; Hashimoto, Masanori ; Onodera, Hidetoshi

  • Author_Institution
    Dept. CCE, Kyoto Univ., Japan
  • fYear
    2005
  • fDate
    10-13 May 2005
  • Firstpage
    201
  • Lastpage
    202
  • Abstract
    This paper discusses shielding effect of power/ground wires in lower layer. A conducting substrate affects characteristics of on-chip transmission line. However in many cases on actual chips, there are P/G wires between the signal wire and the substrate that may shield the substrate coupling. We show measurement and simulation results of on-chip transmission-lines with narrow yet many power/ground wires in a lower layer. Experimental results show that narrow power/ground wires in a lower layer in parallel to the signal wire, which are common in LSI power distribution network, shield substrate coupling and suppress substrate loss. On the other hand, orthogonal power/ground wires in a lower layer hardly mitigate substrate coupling.
  • Keywords
    cable shielding; integrated circuit interconnections; large scale integration; LSI power distribution network; ground wire; on-chip transmission line; orthogonal power wire; shielding effect; signal wire; substrate coupling; substrate loss; Couplings; Large scale integration; Power measurement; Power systems; Power transmission lines; Propagation losses; Semiconductor device measurement; Transmission line measurements; Transmission lines; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects, 2005. Proceedings. 9th IEEE Workshop on
  • Print_ISBN
    0-7803-9054-7
  • Type

    conf

  • DOI
    10.1109/SPI.2005.1500944
  • Filename
    1500944