DocumentCode
1862356
Title
GaN RF device technology and applications, present and future
Author
Green, Bruce ; Moore, Kevin ; Hill, D. ; CdeBaca, Monica ; Schultz, Jamie
Author_Institution
RF, Freescale Semicond., Tempe, AZ, USA
fYear
2013
fDate
Sept. 30 2013-Oct. 3 2013
Firstpage
101
Lastpage
106
Abstract
Over the last decade, Gallium Nitride (GaN) has emerged as a mainstream RF technology with disruptive performance potential. Here, we present GaN technology in the context of current commercial RF communications applications as well as future applications. We show state of the art >200W, >75% efficient packaged device performance at 2.14 GHz using a 0.6 μm 48 V technology and apply the device technology to a 400 W ultra-small footprint Doherty power amplifier. We also describe extending the 0.6 μm technology to a 0.2 μm gate length that allows for higher fT that will enable future technology for high-efficiency switch-mode amplifiers.
Keywords
III-V semiconductors; UHF power amplifiers; gallium compounds; wide band gap semiconductors; GaN; RF device technology; commercial RF communications applications; frequency 2.14 GHz; high-efficiency switch-mode amplifiers; power 400 W; size 0.2 mum; size 0.6 mum; ultra-small footprint Doherty power amplifier; voltage 48 V; Gain; Gallium nitride; HEMTs; Logic gates; MODFETs; Performance evaluation; Radio frequency; GaN; Power Amplifier; SiC;
fLanguage
English
Publisher
ieee
Conference_Titel
Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2013 IEEE
Conference_Location
Bordeaux
ISSN
1088-9299
Print_ISBN
978-1-4799-0126-5
Type
conf
DOI
10.1109/BCTM.2013.6798154
Filename
6798154
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