• DocumentCode
    1862484
  • Title

    InP HBT technology and modeling

  • Author

    Hitko, Donald A. ; Li, James C.

  • Author_Institution
    Microelectron. Lab.., HRL Labs. LLC, Malibu, CA, USA
  • fYear
    2013
  • fDate
    Sept. 30 2013-Oct. 3 2013
  • Firstpage
    123
  • Lastpage
    126
  • Abstract
    InP HBT technologies have reached a level of maturity where mixed-signal ICs with 1000s of transistors have become fairly routine in a regime where high speed, low jitter, and high dynamic range are discriminators, necessitating simulator-efficient compact model representations covering a range of device sizes and all operating modes. In comparison to the more traditional graded-base SiGe bipolar devices, InP HBTs have a number of traits that make them unique from a modeling perspective. An overview of InP HBT device characteristics is presented, along with highlights of a comprehensive device characterization and modeling strategy implemented to support the development of a scalable compact model based on VBIC for the design of high-speed mixed-signal circuits.
  • Keywords
    Ge-Si alloys; III-V semiconductors; heterojunction bipolar transistors; indium compounds; jitter; mixed analogue-digital integrated circuits; semiconductor device models; InP; SiGe; VBIC; bipolar devices; device characterization; high-speed mixed-signal integrated circuits; semiconductor device models; Capacitance; Heterojunction bipolar transistors; Indium phosphide; Integrated circuit modeling; Resistance; Semiconductor device modeling; Heterojunction Bipolar Transistors (HBTs); InP; modeling; simulation; thermal;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2013 IEEE
  • Conference_Location
    Bordeaux
  • ISSN
    1088-9299
  • Print_ISBN
    978-1-4799-0126-5
  • Type

    conf

  • DOI
    10.1109/BCTM.2013.6798159
  • Filename
    6798159