DocumentCode
1862506
Title
Control for high heat chips´ cooling based on power consumption and temperature signals
Author
Wang, Jian ; Liu, Chuan-yang
Author_Institution
Sch. of Electron. & Inf. Engeering, Univ. of Sci. & Technol. of Suzhou, Suzhou, China
fYear
2012
fDate
3-5 Sept. 2012
Firstpage
409
Lastpage
412
Abstract
For CPU chips´ cooling task, existing mono-variable control system has the defects of delay, fluctuation and high energy consumption. With the trend of multi-core and high frequency work pulse in CPU chips, traditional system does not fit for future cooling task. Several approaches such as chips´ dissipated power nonlinear feed-forward, core temperature tracking and surface temperature feed-back are applied to improve control system. Simulations prove that comparing with the traditional out-core temperature based mono-input-output proportion tracking strategy, the improved system can bring better quality and energy-saving results. Also, the new system has parameters adaptability.
Keywords
cooling; feedforward; microprocessor chips; temperature control; thermal management (packaging); CPU chips cooling task; core temperature tracking; dissipated power nonlinear feedforward; high heat chips cooling; monoinput-output proportion tracking; monovariable control system; power consumption; surface temperature feedback; temperature signal; Actuators; Cooling; Erbium; Heating; Software; CPU chip; control; cooling; feed-forward; power dissipation; temperature; usage rate;
fLanguage
English
Publisher
ieee
Conference_Titel
Control (CONTROL), 2012 UKACC International Conference on
Conference_Location
Cardiff
Print_ISBN
978-1-4673-1559-3
Electronic_ISBN
978-1-4673-1558-6
Type
conf
DOI
10.1109/CONTROL.2012.6334665
Filename
6334665
Link To Document