DocumentCode :
1862506
Title :
Control for high heat chips´ cooling based on power consumption and temperature signals
Author :
Wang, Jian ; Liu, Chuan-yang
Author_Institution :
Sch. of Electron. & Inf. Engeering, Univ. of Sci. & Technol. of Suzhou, Suzhou, China
fYear :
2012
fDate :
3-5 Sept. 2012
Firstpage :
409
Lastpage :
412
Abstract :
For CPU chips´ cooling task, existing mono-variable control system has the defects of delay, fluctuation and high energy consumption. With the trend of multi-core and high frequency work pulse in CPU chips, traditional system does not fit for future cooling task. Several approaches such as chips´ dissipated power nonlinear feed-forward, core temperature tracking and surface temperature feed-back are applied to improve control system. Simulations prove that comparing with the traditional out-core temperature based mono-input-output proportion tracking strategy, the improved system can bring better quality and energy-saving results. Also, the new system has parameters adaptability.
Keywords :
cooling; feedforward; microprocessor chips; temperature control; thermal management (packaging); CPU chips cooling task; core temperature tracking; dissipated power nonlinear feedforward; high heat chips cooling; monoinput-output proportion tracking; monovariable control system; power consumption; surface temperature feedback; temperature signal; Actuators; Cooling; Erbium; Heating; Software; CPU chip; control; cooling; feed-forward; power dissipation; temperature; usage rate;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Control (CONTROL), 2012 UKACC International Conference on
Conference_Location :
Cardiff
Print_ISBN :
978-1-4673-1559-3
Electronic_ISBN :
978-1-4673-1558-6
Type :
conf
DOI :
10.1109/CONTROL.2012.6334665
Filename :
6334665
Link To Document :
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