• DocumentCode
    1862506
  • Title

    Control for high heat chips´ cooling based on power consumption and temperature signals

  • Author

    Wang, Jian ; Liu, Chuan-yang

  • Author_Institution
    Sch. of Electron. & Inf. Engeering, Univ. of Sci. & Technol. of Suzhou, Suzhou, China
  • fYear
    2012
  • fDate
    3-5 Sept. 2012
  • Firstpage
    409
  • Lastpage
    412
  • Abstract
    For CPU chips´ cooling task, existing mono-variable control system has the defects of delay, fluctuation and high energy consumption. With the trend of multi-core and high frequency work pulse in CPU chips, traditional system does not fit for future cooling task. Several approaches such as chips´ dissipated power nonlinear feed-forward, core temperature tracking and surface temperature feed-back are applied to improve control system. Simulations prove that comparing with the traditional out-core temperature based mono-input-output proportion tracking strategy, the improved system can bring better quality and energy-saving results. Also, the new system has parameters adaptability.
  • Keywords
    cooling; feedforward; microprocessor chips; temperature control; thermal management (packaging); CPU chips cooling task; core temperature tracking; dissipated power nonlinear feedforward; high heat chips cooling; monoinput-output proportion tracking; monovariable control system; power consumption; surface temperature feedback; temperature signal; Actuators; Cooling; Erbium; Heating; Software; CPU chip; control; cooling; feed-forward; power dissipation; temperature; usage rate;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Control (CONTROL), 2012 UKACC International Conference on
  • Conference_Location
    Cardiff
  • Print_ISBN
    978-1-4673-1559-3
  • Electronic_ISBN
    978-1-4673-1558-6
  • Type

    conf

  • DOI
    10.1109/CONTROL.2012.6334665
  • Filename
    6334665