DocumentCode :
1862642
Title :
Impact of reverse EB stress and mixed-mode stress on low-frequency noise for SiGe HBTs in forward and inverse modes
Author :
Jin Tang ; Jonggook Kim ; Babcock, Jeff A. ; Sadovnikov, Alexander ; Krakowski, Tracey L.
Author_Institution :
Texas Instrum. Inc., Santa Clara, CA, USA
fYear :
2013
fDate :
Sept. 30 2013-Oct. 3 2013
Firstpage :
163
Lastpage :
166
Abstract :
We present in this work the impact of electrical reliability stress on low-frequency noise for SiGe HBTs in forward and inverse modes. The reverse EB stress and the forward mixed-mode stress are investigated. For the first time inverse mode noise is used as a tool to investigate stress-induced damage. The fact that reverse EB stress degrades SiGe HBTs low-frequency noise in the forward mode but not in the inverse mode indicates that the stress-induced traps are located in the EB spacer oxide. Mixed-mode stress degrades both the forward and inverse modes low-frequency noise, consistent with the theory that both the EB and CB junctions are damaged during the stress. The observed noise degradation under stress calls for accurate noise aging modeling in reliability simulation.
Keywords :
Ge-Si alloys; heterojunction bipolar transistors; semiconductor device reliability; EB spacer oxide; HBT; SiGe; electrical reliability stress; first time inverse mode noise; forward modes low-frequency noise; heterojunction bipolar transistors; inverse modes low-frequency noise; mixed-mode stress; reverse EB stress; stress-induced traps; Degradation; Junctions; Low-frequency noise; Silicon germanium; Stress; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2013 IEEE
Conference_Location :
Bordeaux
ISSN :
1088-9299
Print_ISBN :
978-1-4799-0126-5
Type :
conf
DOI :
10.1109/BCTM.2013.6798166
Filename :
6798166
Link To Document :
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