DocumentCode
186281
Title
Evaluation of bend sensors for limb motion monitoring
Author
Borghetti, M. ; Sardini, Emilio ; Serpelloni, Mauro
Author_Institution
Dip. di Ing. dell´Inf., Univ. degli studi di Brescia, Brescia, Italy
fYear
2014
fDate
11-12 June 2014
Firstpage
1
Lastpage
5
Abstract
Bend sensors are composed of a flexible substrate and a conductive layer, which changes its electrical resistance with the bending or the angular displacement. They are flexible, light and low-cost devices, usually adopted to measure the human joint motion. For example, bend sensors can be mounted over the elbow, the knee or the finger measuring their angular position. Commercially, different types of bend sensors are available. In this paper, four types of sensor made of a carbon ink-based layer were studied. These sensors differ for the protective layer over the conductive ink. Their electrical resistance also decays over time and depends on how the sensor is fixed on the joint. A preliminary evaluation is reported on this paper. In particular, the behavior of the electrical resistance of the sensors varying the bending angle and the decay of the resistance over time are reported. The goal of this study is to give information about these sensors to the designers in order to increase knowledge for a metrological characterization and to choose the best strategies to design a biomedical device for limb motion monitoring.
Keywords
bending; biomechanics; biomedical equipment; biomedical measurement; electrical resistivity; position measurement; angular displacement; angular position; bend sensor; bending angle; biomedical device design; carbon ink-based layer; conductive ink; conductive layer; elbow; electrical resistance behavior; finger measurement; flexible device; flexible substrate; human joint motion measurement; knee; light device; limb motion monitoring; low-cost device; metrological characterization; preliminary evaluation; protective layer; resistance decay; Electrical resistance measurement; Immune system; Ink; Polymers; Resistance; Sensor phenomena and characterization; bend sensors; hopping effect; microcracks; piezoresistance; strain; stress; tunneling effect; viscoelastic material;
fLanguage
English
Publisher
ieee
Conference_Titel
Medical Measurements and Applications (MeMeA), 2014 IEEE International Symposium on
Conference_Location
Lisboa
Print_ISBN
978-1-4799-2920-7
Type
conf
DOI
10.1109/MeMeA.2014.6860127
Filename
6860127
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