• DocumentCode
    186289
  • Title

    Pressure sensing platform for health monitoring

  • Author

    Cruz, S. ; Viana, J.C. ; Dias, Daniel Henrique ; Rocha, Lucio A.

  • Author_Institution
    Eng. Dept., Univ. of Minho, Guimaraes, Portugal
  • fYear
    2014
  • fDate
    11-12 June 2014
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    A new flexible pressure mapping platform using Inkjet Printing technology for application in health monitoring is presented here. The printing technology enables a simple, low cost and large scale manufacturing process. The sensing platform consists in a flexible PCB (Printed Circuit Boards) manufactured using conventional technology (defining the electrical connections and the capacitors dimensions) together with two flexible polymeric membranes (TPU) printed with conductive ink (PEDOT:PSS) for definition of the electrodes. A Capacitance to Digital Converter (CDC) is used to measure the capacitance of the sensors, and a graphical interface in MATLAB allows realtime visualization of data. The first prototype flexible sensors present a sensitivity of 100fF/kPa in the region of operation.
  • Keywords
    biomedical electrodes; biomedical electronics; capacitance measurement; capacitors; data visualisation; health care; ink jet printing; patient monitoring; polymers; pressure sensors; printed circuits; MATLAB; capacitance-digital converter; capacitor dimensions; conductive ink; electrical connections; electrodes; flexible polymeric membranes; flexible pressure mapping platform; flexible printed circuit boards; graphical interface; health monitoring; inkjet printing technology; pressure sensing platform; pressure sensor capacitance measurement; real-time data visualization; Capacitive sensors; Electrodes; Pressure measurement; Robot sensing systems; Substrates; Flexible PCB; Flexible pressure mapping system; Health Monitoring Device; Inkjet Printing; PEDOT; PSS;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Medical Measurements and Applications (MeMeA), 2014 IEEE International Symposium on
  • Conference_Location
    Lisboa
  • Print_ISBN
    978-1-4799-2920-7
  • Type

    conf

  • DOI
    10.1109/MeMeA.2014.6860131
  • Filename
    6860131