DocumentCode
1862921
Title
Transient behavior of self-assembled quantum dots formed by atomic layer epitaxy technique
Author
Park, Y.M. ; Park, Y.J. ; Kim, K.M. ; Shin, J.C. ; Song, J.D. ; Lee, J.I. ; Yoo, K.H.
Author_Institution
Nano Device Res. Center, Korean Inst. of Sci. & Technol., Seoul, South Korea
fYear
2003
fDate
25-27 Aug. 2003
Firstpage
49
Lastpage
54
Abstract
We investigated the effects of carrier dynamics on the temperature dependence of the photoluminescence (PL) of an InGaAs dots-in-a-well (DWELL) structure. The quantum dots (QDs) were formed by the atomic layer epitaxy (ALE) technique alternately supplying InAs and GaAs sources. It was found from the PL measurements at various temperatures that the DWELL structure was accomplished through the generation process of the intermediate layer between the quantum well (QW) and the QDs during the formation of the QDs inside a QW. The thermal quenching equations on the basis of the rate equation model can be explained by the carrier dynamics, which included in the radiative recombination, the carrier thermal escape and the carrier capture process occurring in these three layers, i.e. QW, QD and the intermediate layer.
Keywords
III-V semiconductors; atomic layer epitaxial growth; carrier relaxation time; electron traps; gallium arsenide; indium compounds; photoluminescence; quenching (thermal); self-assembly; semiconductor quantum dots; semiconductor quantum wells; InGaAs; atomic layer epitaxy technique; carrier capture process; carrier dynamics; carrier thermal escape; dots-in-a-well structure; photoluminescence; radiative recombination; rate equation model; self-assembled quantum dots; thermal quenching equations; Atomic layer deposition; Atomic measurements; Epitaxial growth; Equations; Indium gallium arsenide; Photoluminescence; Quantum dots; Temperature dependence; Temperature measurement; Thermal quenching;
fLanguage
English
Publisher
ieee
Conference_Titel
Compound Semiconductors: Post-Conference Proceedings, 2003 International Symposium on
Print_ISBN
0-7803-8614-0
Type
conf
DOI
10.1109/ISCSPC.2003.1354430
Filename
1354430
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