Spectroscopic measurement of packaging induced strains in high-power laser diode arrays

Author

Tomm, Jens W. ; Muller, Rudolf ; Barwolff, A. ; Elsaesser, Thomas ; Gerhardt, A. ; Donecker, J. ; Lorenzen, D. ; Daiminger, Franz Xaver ; Weiss, Steven ; Hutter, Marcus ; Reichl, Herbert

Author_Institution

Max-Born-Inst. fur Nichlineare Opt. & Kurzzeitspektroskopie, Berlin, Germany

fYear

1999

fDate

28-28 May 1999

Firstpage

145

Lastpage

146

Abstract

Summary form only given. High-power diode lasers are important for a wide range of applications, e.g. as pump sources for solid state lasers and tools for material processing. For managing the thermal load connected with high power operation, complex device and heat sink architectures are required. In particular, the semiconductor structure must be mounted ´p-side down´ on a heat sink of high thermal conductivity. In such a geometry, mechanical strain of the active region represents a central issue, affecting both the parameters of laser emission and the lifetime of the device.

Keywords

packaging; piezo-optical effects; semiconductor lasers; thermal conductivity; thermo-optical effects; active region; complex device architecture; device lifetime; heat sink architecture; high power operation; high thermal conductivity; high-power laser diode arrays; laser emission; mechanical strain; packaging induced strains; pump sources; solid state lasers; thermal load management; Diode lasers; Heat sinks; Laser excitation; Materials processing; Packaging; Solid lasers; Spectroscopy; Strain measurement; Thermal conductivity; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics, 1999. CLEO '99. Summaries of Papers Presented at the Conference on

Conference_Location

Baltimore, MD, USA

Print_ISBN

1-55752-595-1

Type

conf

DOI

10.1109/CLEO.1999.834006

Filename

834006