Design, fabrication, and assembly of a hollow-core fiber-based micro cryogenic cooler

Author

Lin, M.-H. ; Bradley, P.E. ; Wu, H.-J. ; Booth, J.C. ; Radebaugh, R. ; Lee, Y.C.

Author_Institution

DARPA Center for Integrated Micro/Nano-Electromech. Transducers (iMINT), Univ. of Colorado at Boulder, Boulder, CO, USA

fYear

2009

fDate

21-25 June 2009

Firstpage

1114

Lastpage

1117

Abstract

One of the smallest Joule Thomson (J-T) micro cryogenic coolers (MCC) utilizing a hollow-core fiber-based heat exchanger (HX) is designed, fabricated, assembled and tested. Techniques that control mask material etching are developed to fabricate a multi-layer silicon structure on HX-coupling manifolds. A segmental metal coating is applied on the fibers and the capillary for solderable areas and reduced radiation and conduction heat transfer. With 16:1 pressure ratio mixed refrigerants, a 140 K stable temperature and 76 K transient temperature at cold head are demonstrated.

Keywords

Joule-Thomson effect; coating techniques; cryogenic electronics; heat exchangers; microassembling; microfabrication; Joule Thomson micro cryogenic coolers; assembly; fabrication; heat exchanger; hollow-core fiber; segmental metal coating; Assembly; Coatings; Conducting materials; Cryogenics; Etching; Fabrication; Heat transfer; Optical fiber testing; Silicon; Temperature; Joule Thomson cryocooler; Micro cryogenic cooler; hollow-core fiber; micro heat exchanger;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International

Conference_Location

Denver, CO

Print_ISBN

978-1-4244-4190-7

Electronic_ISBN

978-1-4244-4193-8

Type

conf

DOI

10.1109/SENSOR.2009.5285925

Filename

5285925