• DocumentCode
    1865135
  • Title

    Three-dimensional microstructures fabricated by multi-step electrochemical etching of aluminum sheet

  • Author

    Kim, Y. ; Youn, S. ; Han, W. ; Cho, Y.-H. ; Park, H. ; Chang, B. ; Oh, Y.

  • Author_Institution
    Dept. of Bio&Brain Eng., KAIST, Daejeon, South Korea
  • fYear
    2009
  • fDate
    21-25 June 2009
  • Firstpage
    1059
  • Lastpage
    1062
  • Abstract
    We present a fabrication process for three-dimensional (3D) microstructures using multi-step electrochemical etching of metal foils. The present process offers advantages of simple, cost-effective, and fast process with uniform and well-controlled material property. In the experimental study, we performed single-step electrochemical etching of 2D cantilever array and multi-step electrochemical etching of 3D micro probe array. The average depth etch rate and the average bias etch rate were measured as 1.50 plusmn 0.10 mum/min, and 0.77 plusmn 0.03 mum wide structure. The surface roughness of 11.34 nm has been measured. The demonstrated multi-step electrochemical etching process results in a simple, cost-effective, and timesaving fabrication of 3D metallic structures.
  • Keywords
    aluminium; cantilevers; electrochemical analysis; electrochemistry; etching; foils; probes; sheet materials; surface roughness; 2D cantilever array; 3D microstructures; Al; aluminum sheet; metal foils; metallic structures; micro probe array; multistep electrochemical etching; surface roughness; Aluminum; Etching; Microstructure; Aluminum Etching; Electrochemical Etching; Metal 3D structure; Micro Probe; Multi-step etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
  • Conference_Location
    Denver, CO
  • Print_ISBN
    978-1-4244-4190-7
  • Electronic_ISBN
    978-1-4244-4193-8
  • Type

    conf

  • DOI
    10.1109/SENSOR.2009.5285941
  • Filename
    5285941