Title :
Three-dimensional microstructures fabricated by multi-step electrochemical etching of aluminum sheet
Author :
Kim, Y. ; Youn, S. ; Han, W. ; Cho, Y.-H. ; Park, H. ; Chang, B. ; Oh, Y.
Author_Institution :
Dept. of Bio&Brain Eng., KAIST, Daejeon, South Korea
Abstract :
We present a fabrication process for three-dimensional (3D) microstructures using multi-step electrochemical etching of metal foils. The present process offers advantages of simple, cost-effective, and fast process with uniform and well-controlled material property. In the experimental study, we performed single-step electrochemical etching of 2D cantilever array and multi-step electrochemical etching of 3D micro probe array. The average depth etch rate and the average bias etch rate were measured as 1.50 plusmn 0.10 mum/min, and 0.77 plusmn 0.03 mum wide structure. The surface roughness of 11.34 nm has been measured. The demonstrated multi-step electrochemical etching process results in a simple, cost-effective, and timesaving fabrication of 3D metallic structures.
Keywords :
aluminium; cantilevers; electrochemical analysis; electrochemistry; etching; foils; probes; sheet materials; surface roughness; 2D cantilever array; 3D microstructures; Al; aluminum sheet; metal foils; metallic structures; micro probe array; multistep electrochemical etching; surface roughness; Aluminum; Etching; Microstructure; Aluminum Etching; Electrochemical Etching; Metal 3D structure; Micro Probe; Multi-step etching;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
DOI :
10.1109/SENSOR.2009.5285941