Title :
Development of integrated 3D radio front-end system-on-package (SOP)
Author :
Laskar, J. ; Sutono, A. ; Lee, C.-H. ; Davis, M.F. ; Maeng, M. ; Lal, N. ; Lim, K. ; Pinel, S. ; Tentzeris, M. ; Obatoyinbo, A.
Author_Institution :
Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This paper presents the development and characterization of compact and highly integrated microwave and millimeter wave radio front-end Systems-on-Package (SOP). The three-dimensional transceiver front-end SOP architectures incorporate on-package integrated lumped element passives as well as RF functions primarily filters, baluns, and antennas in standard multi-layer LTCC and fully-organic technologies. An LTCC-based 14 GHz transmitter for satellite outdoor unit, an OC-192 transmitter incorporating Ku-band Optical Sub-Carrier Multiplexing (OSCM) technique as well fully-organic SOP transmission lines and lumped-element components have been demonstrated. These prototypes suggest the feasibility of developing highly miniaturized cost-effective SOP transceivers applicable not only for wireless but also for optoelectronics links.
Keywords :
ceramic packaging; microwave circuits; millimetre wave circuits; modules; optical transmitters; subcarrier multiplexing; transceivers; 14 GHz; Ku-band optical sub-carrier multiplexing; MM-wave radio front-end; OC-192 transmitter; RF functions; X-band transmitter; ceramic-based architecture; fully-organic technologies; fully-organic transmission lines; highly miniaturized transceivers; integrated 3D radio front-end; microwave radio front-end; multi-layer LTCC technology; on-package integrated lumped element passives; optoelectronics links; organic-based architecture; package characterization; satellite outdoor unit; system-on-package; transceiver front-end; wireless links; Impedance matching; Microwave filters; Millimeter wave technology; Optical devices; Optical filters; Optical transmitters; Radio frequency; Radio transmitters; Satellite broadcasting; Transceivers;
Conference_Titel :
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 2001. 23rd Annual Technical Digest
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-6663-8
DOI :
10.1109/GAAS.2001.964381
