DocumentCode :
1865872
Title :
Encapsulation of microparticles and biomolecules based on layer-by-layer nanoassembly techniques with microfluidic droplet devices
Author :
Gong, Zhongcheng ; Penmetsa, Siva ; Zheng, Zhiguo ; Lvov, Yuri ; Que, Long
Author_Institution :
Inst. for Micromanufacturing, Louisiana Tech Univ., Ruston, LA, USA
fYear :
2009
fDate :
21-25 June 2009
Firstpage :
1043
Lastpage :
1046
Abstract :
This paper reports the encapsulation of microparticles (mu-particles) and biomolecules using the layer-by-layer (LbL) nanoassembly technique with droplet microfluidic devices. This so-called droplet-LbL microchip consists of two microfluidic droplet generators, a microfluidic droplet-merging channel and a microfluidic mixing channel. The assembly of positive-charged PDDA layer on 3T3 cells has been successfully demonstrated, resulting in their surface potential change from -25.81 mV to 40.16 mV. The successful encapsulation of negative-charged mu-particles (polymethacrylate) within FITC-labeled protamine sulphate layer is also confirmed by their fluorescence image.
Keywords :
bioMEMS; bioelectric potentials; encapsulation; fluorescence; lab-on-a-chip; microchannel flow; nanophotonics; nanotechnology; optical images; self-assembly; FITC-labeled protamine sulphate layer; biomolecule based layer-by-layer nanoassembly technique; droplet-LbL microchip; fluorescence image; layer-by-layer nanoassembly technique; microfluidic droplet device; microfluidic droplet generator; microfluidic droplet-merging channel; microfluidic mixing channel; microparticle encapsulation; nanophotonics; negative-charged mu-particles; positive-charged PDDA layer; surface potential; voltage -25.81 mV to 40.16 mV; Encapsulation; Microfluidics; Molecular biophysics; Nanoscale devices; Droplet-microfluidics; layer-by-layer nano-selfassembly; microparticles and biomoleculesencapsulation; nanomanufacturing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
Type :
conf
DOI :
10.1109/SENSOR.2009.5285967
Filename :
5285967
Link To Document :
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