DocumentCode :
186652
Title :
Cross-layer system resilience at affordable power
Author :
Gupta, Meeta S. ; Rivers, Jude A. ; Liang Wang ; Bose, Pradip
Author_Institution :
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
fYear :
2014
fDate :
1-5 June 2014
Abstract :
In this paper, we address the challenge of achieving very high energy efficiency, while meeting target levels of performance and resilience to transient errors. We focus mainly at the processor chip level, while keeping in mind two ends of the system spectrum: (a) low power, real-time constrained embedded systems; and (b) extreme-scale high performance systems (or supercomputers). We advocate and illustrate the use of cross-layer resilience optimization as a general solution strategy.
Keywords :
embedded systems; integrated circuit design; low-power electronics; microprocessor chips; multiprocessing systems; radiation hardening (electronics); SER; cross-layer system resilience optimization; energy efficiency; extreme-scale high performance systems; low power real-time constrained embedded systems; processor chip level; system spectrum; system-level soft error rate; transient errors; Energy efficiency; Microarchitecture; Multicore processing; Optimization; Registers; Resilience; Throughput; energy efficiency; high performance; system resilience;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 2014 IEEE International
Conference_Location :
Waikoloa, HI
Type :
conf
DOI :
10.1109/IRPS.2014.6860584
Filename :
6860584
Link To Document :
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