From VLSI to WLSI an introduction to 3D wafer level system integration

Wafer level system integration (WLSI) as the new system scaling technology platform is taking the stage in parallel to transistor level Moor´s Law scaling to drive the semiconductor industry moving forward in new mobile computing and Internet-of-Thing (IoT) markets. Two key WLSI technology platforms, Chip-on-Wafer-on-Substrate (CoWoS) and Integrated Fan-Out (InFO) are introduced and their merits are discussed. Both CoWoS and InFO are scalable and sustainable to continuously driving future semiconductor industry revolution.