DocumentCode :
1867014
Title :
Quality and reliability investigation of Ni/Sn transient liquid phase bonding technology
Author :
Tsung-Yen Tsai ; Yao-Jen Chang ; Kuan-Neng Chen
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear :
2015
fDate :
June 29 2015-July 2 2015
Firstpage :
492
Lastpage :
495
Abstract :
A submicron of Ni/Sn transient liquid phase bonding at low temperature was investigated to surmount nowadays fine-pitch Cu/Sn process challenge. After bonding process, only uniform and high-temperature stable Ni3Sn4 intermetallic compound was existed. In addition, the advantages of this scheme showed excellent electrical and reliability performance and mechanical strength.
Keywords :
alloys; bonding processes; copper; fine-pitch technology; nickel; tin; Cu-Sn; Ni-Sn; Ni3Sn4; bonding process; fine-pitch process challenge; intermetallic compound; transient liquid phase bonding technology; Bonding; Contact resistance; Liquids; Nickel; Reliability; Tin; Transient analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location :
Hsinchu
Type :
conf
DOI :
10.1109/IPFA.2015.7224326
Filename :
7224326
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1867014
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