DocumentCode :
1867165
Title :
Non-destructive measurement of the degree of cross-linking of EVA solar module encapsulation
Author :
Lloyd, John ; Christian, Theresa ; Doble, Dan ; Mickiewicz, Rafal A.
Author_Institution :
Fraunhofer Center for Sustainable Energy Syst. (CSE), Cambridge, MA, USA
fYear :
2011
fDate :
19-24 June 2011
Abstract :
A novel technique was developed to correlate the degree of cross-linking in laminated ethylene vinyl acetate (EVA) solar encapsulation with the cured EVA viscoelastic response by means of a compressive stress relaxation measurement. The technique was demonstrated on mini-modules fabricated with two different commercially available EVA encapsulants and four different commercially available backsheets. The indentation test was found to be most sensitive at elevated temperature and it was possible to predict the gel content of low, medium, and high cross-linked samples to at least a 95% confidence level. Furthermore, the method was found to be nondestructive and can be applied to photovoltaic modules after lamination, enabling a rapid metrology technique for process and quality control in module manufacturing.
Keywords :
compressive strength; encapsulation; indentation; nondestructive testing; organic compounds; quality control; solar cells; EVA solar module encapsulation; compressive stress relaxation measurement; cross-linking; cured EVA viscoelastic response; gel content; indentation test; laminated ethylene vinyl acetate; nondestructive measurement; photovoltaic modules; quality control; rapid metrology; Force; Force measurement; Polymers; Solvents; Stress; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
Conference_Location :
Seattle, WA
ISSN :
0160-8371
Print_ISBN :
978-1-4244-9966-3
Type :
conf
DOI :
10.1109/PVSC.2011.6186408
Filename :
6186408
Link To Document :
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