Title :
Impact of VLSI scaling on die qualification
Author :
Haggag, A. ; Phillips, Malcolm ; Lee, J. K. Jerry
Author_Institution :
Freescale Semicond., Inc., Austin, TX, USA
Abstract :
As technology scales, the dominant die failure modes under voltage and environmental stress change to ones with higher acceleration factors suggesting industry standard electrical and environmental die qualification guidelines of stress tests are built with margin to cover mission life. Therefore running the full qualification helps demonstrate margin to the dominant failure modes yielding longer lifetime die.
Keywords :
VLSI; failure analysis; integrated circuit reliability; stress analysis; VLSI scaling; acceleration factors; dominant die failure modes; electrical die qualification; environmental die qualification; environmental stress; lifetime die; stress tests; technology scaling; voltage stress; Acceleration; Logic gates; Moisture; Qualifications; Standards; Stress; Voltage measurement;
Conference_Titel :
Reliability Physics Symposium, 2014 IEEE International
Conference_Location :
Waikoloa, HI
DOI :
10.1109/IRPS.2014.6860619