Title :
Application of FIB-SEM and Raman spectroscopy for investigating conductive carbon particles in epoxy encapsulation of IC
Author :
Shih Chia Lai ; Sharma, Pradeep ; Otte, Rik ; Jung Hao Kung ; Yao-han Wang ; Chen, Sharon
Author_Institution :
Regional Quality Centre-Kaohsiung, NXP Semicond. N.V., Taiwan
fDate :
June 29 2015-July 2 2015
Abstract :
We report investigation about three types of conductive carbon particles viz. pure carbon particles, SiO2 filler mixed carbon particles, and SiO2@C core-shell particles in epoxy encapsulations of IC. SEM, EDX, FIB voltage contrast imaging, and Raman spectroscopy are used to characterize conductive carbon particles, and to identify their potential origin.
Keywords :
Raman spectroscopy; carbon; encapsulation; focused ion beam technology; integrated circuit packaging; integrated circuit testing; scanning electron microscopy; EDX; FIB voltage contrast imaging; FIB-SEM; IC; Raman spectroscopy; SiO2-C; conductive carbon particles; core-shell particles; epoxy encapsulation; focused ion beam; integrated circuit; scanning electron microscopy; Bonding; Carbon; Electromagnetic compatibility; Encapsulation; Integrated circuits; Scanning electron microscopy; Wires;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location :
Hsinchu
DOI :
10.1109/IPFA.2015.7224332
