Title :
Feasibility study of TOF-SIMS surface measurement for Aluminum bond pad fluorine contamination
Author :
Han Wei Teo ; Yanjing Yang ; Yun Wang ; Lei Zhu ; Zhi Qiang Mo ; Si Ping Zhao ; Lam, Jeffrey
Author_Institution :
Testing & Failure Anal. Dept., GLOBALFOUNDRIES Singapore Pte. Ltd., Singapore, Singapore
fDate :
June 29 2015-July 2 2015
Abstract :
This paper elucidates the importance of ion-yield enhancement through primary-ion bombardment in ultra-high surface sensitive Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS) measurements of Aluminum bond pad fluorine contamination. A good correlation is achieved, R2 of 0.97, with Auger Electron Spectroscopy (AES) that is commonly used for bond pad surface contamination quantification.
Keywords :
integrated circuit measurement; integrated circuit yield; surface contamination; time of flight mass spectroscopy; Auger Electron Spectroscopy; TOF-SIMS surface measurement; aluminum bond pad fluorine contamination; ion yield enhancement; primary ion bombardment; time-of-flight secondary ion mass spectrometry; ultrahigh surface sensitive mass spectrometry; Correlation; Mass spectroscopy; Pollution measurement; Surface contamination; Surface morphology; AES; Aluminum Bond Pad; Fluorine Contamination; Ion-yield enhancement; TOF-SIMS;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location :
Hsinchu
DOI :
10.1109/IPFA.2015.7224333
