Comparative study of different technology of mechanical decap to check excess solder issue — Conventional versus new approaches

Mechanical decapsulation is a method of removing mold compound material from a packaged electronic device of the type encapsulated with a protective material that forms an outer surface of the device [1]. Though wet decapsulation is certainly the most common method, it is not appropriate for all types of semiconductor failure analysis. Contaminants on the surface and side of the semiconductor die can be washed away by the acids and solvents; if the contaminants had no secondary effect (for example, corrosion of the traces on the IC and solder remelt traces on the side wall of the die). Thus, there will be no remaining clue as to the root cause of failure on the device. Different decapsulation approach is necessary which is for this case, mechanical decapsulation much more appropriate approach to be used [2]. This paper aims to describe and compare conventional mechanical decapsulation and new approaches of mechanical decapsulation to check solder remelt mechanism on the die side wall.