Title :
Fundamentals and future applications of Laser Voltage Probing
Author :
Kindereit, Ulrike
Author_Institution :
Qualcomm Technol., Inc., San Diego, CA, USA
Abstract :
This paper will give an overview of the history of Laser Voltage Probing, explain the physical background of the signal generation process, provide insight into various detection schemes and measurement methods that were and currently are used in the industry and discuss challenges for future technology nodes and highlight development areas.
Keywords :
failure analysis; integrated circuit measurement; integrated circuit reliability; integrated circuit testing; measurement by laser beam; signal detection; detection schemes; failure analysis; laser voltage probing; measurement methods; signal generation process; technology nodes; Indexes; Interference; Laser beams; Measurement by laser beam; Optical refraction; Semiconductor device measurement; Silicon; CW; FinFET; Franz-Keldysh effect; LTP; LVP; MLL; VLI; amplitude; electro-absorption; free carrier effects; frequency mapping; lock-in aplifier; modulation mapping; phase detection; signal generation; spectrum analyzer; thermal; wavelength;
Conference_Titel :
Reliability Physics Symposium, 2014 IEEE International
Conference_Location :
Waikoloa, HI
DOI :
10.1109/IRPS.2014.6860635
