DocumentCode :
1867512
Title :
UTB GeOI 6T SRAM cell and sense amplifier considering BTI reliability
Author :
Hu, Vita Pi-Ho ; Pin Su ; Ching-Te Chuang
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear :
2015
fDate :
June 29 2015-July 2 2015
Firstpage :
111
Lastpage :
114
Abstract :
This paper investigates the impacts of negative and positive bias temperature instabilities (NBTI and PBTI) on the stability of ultra-thin-body (UTB) GeOI 6T SRAM cell and performance of sense amplifier compared with the SOI counterparts. Worst case stress scenarios for read and write operations are analyzed. For UTB GeOI SRAMs, PBTI dominates the degradations in read static noise margin (RSNM), while for UTB SOI SRAMs, NBTI dominates the degradations in RSNM. Write static noise margin (WSNM) only slightly degrades due to NBTI and PBTI. Current latch sense amplifier (CLSA) and voltage latch sense amplifier (VLSA) are analyzed considering NBTI/PBTI for GeOI and SOI devices. GeOI CLSA and VLSA show smaller word-line to SAE buffer delay (TBL) and sense amplifier sensing delay (TSA) than the SOI counterparts. As aging time increases, GeOI CLSA and VLSA show larger degradations of TSA than the SOI counterparts.
Keywords :
SRAM chips; amplifiers; negative bias temperature instability; BTI reliability; NBTI; PBTI; UTB GeOI 6T SRAM cell; current latch sense amplifier; negative bias temperature instabilities; positive bias temperature instabilities; read static noise margin; ultra-thin-body; voltage latch sense amplifier; write static noise margin; Degradation; Delays; MOSFET; SRAM cells; Sensors; Stress; Wireless sensor networks;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location :
Hsinchu
Type :
conf
DOI :
10.1109/IPFA.2015.7224345
Filename :
7224345
Link To Document :
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