DocumentCode :
1867693
Title :
Debugging MBIST hard fails without bitmapping
Author :
Yeoh, B.L. ; Goh, S.H. ; You, G.F. ; Hao, Hu ; Sio, W.L. ; Lam, Jeffrey
Author_Institution :
Technol. Dev., Product Test & Failure Anal., GLOBALFOUNDRIES, Singapore, Singapore
fYear :
2015
fDate :
June 29 2015-July 2 2015
Firstpage :
138
Lastpage :
143
Abstract :
Embedded memories modules are one of the core components in System-on-a-Chip (SoC) device. For memory built-in self-test (MBIST) failures, bitmapping tool is normally used to locate the defect location. This paper demonstrates the effectiveness in the use of dynamic photon emission microscopy (PEM) analysis as an alternative method to debug MBIST failures. We also show how an additional failure characterization step prior to fault localization, can enhance success rate and turnaround time.
Keywords :
built-in self test; failure analysis; system-on-chip; SoC; debugging MBIST hard fails; dynamic photon emission microscopy; embedded memories modules; failure characterization; fault localization; memory built-in self-test failures; system-on-a-chip; Inspection; Metals; Modulation; Photonics; SRAM cells; System-on-chip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location :
Hsinchu
Type :
conf
DOI :
10.1109/IPFA.2015.7224352
Filename :
7224352
Link To Document :
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