• DocumentCode
    186782
  • Title

    Electromigration simulation at circuit levels

  • Author

    Cher Ming Tan

  • Author_Institution
    Sch. oaf EEE, Nanyang Technol. Univ., Singapore, Singapore
  • fYear
    2014
  • fDate
    1-5 June 2014
  • Abstract
    Electromigration has been a dominant failure mechanism for interconnects in ULSI. Extensive research works on the understanding of electromigration and methodologies to enhance interconnect EM lifetime are being proposed. While the ultimate goal of all these studies are to extend the interconnect lifetime in ULSI, all the studies so far are on the test structures, with the belief that their effectiveness will be similar when implemented in circuit level. However, recent studies revealed that this may not be the case, and more considerations are needed when the methodologies are implemented in circuit level. This work shows the need for circuit level electromigration modelling and the method to perform the modelling at circuit level. Examples are shown for digital, analog and RF circuits, and the way to speed up the modelling in complex circuit is also presented, making the method practical for implementation.
  • Keywords
    ULSI; electromigration; failure analysis; integrated circuit interconnections; EM lifetime interconnects; RF circuits; analog circuits; circuit levels; digital circuits; electromigration simulation; failure mechanism; test structures; Integrated circuit interconnections; Integrated circuit modeling; Load modeling; Metals; Solid modeling; Stress; Three-dimensional displays; Digital circuit; RF circuit; analog circuit; circuit structure; test structure; waffle layout;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2014 IEEE International
  • Conference_Location
    Waikoloa, HI
  • Type

    conf

  • DOI
    10.1109/IRPS.2014.6860656
  • Filename
    6860656