DocumentCode
1868237
Title
Debug of implant angle deviation based on SIMS analysis
Author
Jiang Bei Shi ; Zhen Yuan Li ; Xiao Gang Zheng ; AiMin Li ; Qi Hua Zhang ; Ming Li ; Wei Ting Chien ; Yao Bin Zhao
Author_Institution
Failure Anal. Lab., Semicond. Manuf. Int. (Tianjin) Co., Ltd., China
fYear
2015
fDate
June 29 2015-July 2 2015
Firstpage
209
Lastpage
212
Abstract
The accuracy of ion implantation is very important in semiconductor manufacturing and will directly affect the performance of the individual devices and even the whole chip. The deviation of IMP energy, dose and angle are often encountered because of the abnormality of implant equipment or process design limit. The ion implantation energy, dose and angle information can be qualitatively and quantitatively analyzed through SIMS [2], which provides a way to diagnose the issue of ion implanter. Based on SIMS analysis results, we can judge whether ion implant results meet the requirements and whether the process design achieves the expected goal. In this paper we report a SIMS data processing method for the analysis of the deviation of ion implantation angle. A term of deviation rate was defined and the related calculation method was introduced, which is proportional to the deviation angles of the ion implanter. And then, a statistical analysis of a large number of data on deviation rates and ion implantation angles showed that the whole sampling data followed normal distribution, and thus the corresponding 3 sigma could be obtained. Using the determined 3 sigma range of the deviation rates, we can define the acceptable range for deviation rate. Further, we can use the actual deviation rate to judge if the implant equipment needs maintenance or not, or suggest the direction for improvement. The equipment´s maintenance time and cost can thus be minimized. This method can be used as an early detection to find an abnormity in an ion implant tool.
Keywords
ion implantation; secondary ion mass spectroscopy; semiconductor device manufacture; SIMS analysis; SIMS data processing method; calculation method; implant angle deviation; ion implantation; normal distribution; sampling data; semiconductor manufacturing; Fitting; Implants; Ion implantation; Smoothing methods; Standards; Statistical analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location
Hsinchu
Type
conf
DOI
10.1109/IPFA.2015.7224373
Filename
7224373
Link To Document